The maxiFLOW BGA heat sink is a passive thermal management component with a package type of Surface Mount. It measures 33mm in length, 1.299inch in width, and 17.5mm in height, with a height off base of 0.689inch. The heat sink is made of aluminium and has

Advanced Thermal Solutions, Inc.

ConiuGo 700300121 GO DIGITAL OUT BLUELINE

Coniugo

Oscillator MEMS 50.0025MHz a25ppm (Stability) 15pF LVDS 52% 2.5V/3.3V 6-Pin VDFN SMD Tube

ATMEL Corporation

RF Development Tools 869MHZ Eval Mod Kit

Texas Instruments

Cable Markers Pre-Marked White Reel

Tyco Electronics

The NXP MRF7S27130HSR5 is a high-power N-channel MOSFET with a breakdown voltage of 65V and an output power of 23W. It operates within a temperature range of -65`C to 150`C and is suitable for surface mount applications. The device is RoHS compliant and

Motorola, Inc