This heat sink is a passive device with a spread fin style, designed for BGA device cooling. It is mounted via a clip attachment method and has a black anodized finish. The heat sink measures 40mm in length, 40mm in depth, and 19.5mm in height.

Advanced Thermal Solutions, Inc.

Rivets Blind Dome 0.94mm 4.14mm 8.36mm Aluminum Alloy

Acument Global Technologies

IDC Socket and Terminal Cable

Samtec

Cap Ceramic 15pF 1000V X7R 10% Radial 5.08mm 125`C T/R

KEMET

50-contact, two-part board connector with male straight pins. Features a 2.54mm pitch and row spacing, designed for through-hole mounting. Constructed with a copper alloy contact material and gold plating for mating surfaces, offering a 1.75A current ratin

3M

The DSC1001CI5-040.2500 is a 40.25 MHz MEMS oscillator from Microchip, packaged in a 4-pin CDFN. It operates over a supply voltage range of 1.7V to 3.6V and is specified for use over a temperature range of -40`C to 85`C. The device has a frequency stabil

ATMEL Corporation