The maxiGRIP BGA heat sink is a passive thermal management component with a package cooled design. It measures 35mm in length and width, and 14.5mm in height. The heat sink is made of anodized aluminium and features a clip mount. It is available in a packa

Advanced Thermal Solutions, Inc.

Crimpers AT-8200 CRIMP TOOL H 8200 CRIMP TOOL HEAD

MOLEX

64-bit RISC microprocessor featuring a 32nm process technology and a 3.1GHz maximum speed. This Flip-Chip Land Grid Array (FCLGA) package, with 1155 pins and surface mount capability, houses a 2-core architecture. The device operates within a maximum tem

Intel

The LPV1620-500K is a fixed inductor with a radial package and a diameter of 16mm. It has an inductance of 50uH and a maximum DC current rating of 3A. The inductor is available in a through-hole package with a lead pitch of 8mm and a length of 20mm. It is

BOURNS

The ZST-105-01-F-D-515 is a 10-contact elevated shrouded header with a terminal pitch of 2.54mm. It features a maximum operating temperature range of -55 to 125 degrees Celsius and a maximum voltage rating of 600VDC. This header is designed for through-hol

Samtec

This is a 0805 size ceramic chip capacitor with a capacitance of 0.1uF and a voltage rating of 25VDC. It has a tolerance of 20% and is made with X7R dielectric material. The operating temperature range is from -55`C to 125`C. It is a surface mount compon

Walsin