The maxiGRIP BGA heat sink is a passive thermal management component with a thermal resistance of 11.1`C/W at 100 LFM forced air flow. It features a BGA package, is made of anodized aluminium, and has a square shape with fins. The heat sink is available i

Advanced Thermal Solutions, Inc.

QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

Infineon Technologies AG

Kemet's CWR19FH225MCAZ is a 2.2uF surface mount tantalum capacitor with a 10VDC voltage rating and 20% tolerance. It has a low ESR of 0.06 and a leakage current of 1uA. The capacitor operates over a temperature range of -55 to 125 degrees Celsius and is co

KEMET

Precision JFET-input operational amplifier featuring a 3MHz gain bandwidth product and 15V/es slew rate. This single-channel amplifier offers a 100dB common mode rejection ratio and a low input bias current of 200pA. Operates with dual supply voltages f

Texas Instruments

Cable Assembly Coax Micro Ribbon

Samtec

Conn Unshrouded Header HDR 18 POS 5.08mm Solder RA Thru-Hole

Samtec