The maxiFLOW BGA heat sink from Advanced Thermal Solutions is a passive thermal management component with a package type of BGA and a mount type of adhesive. It measures 30mm in length, 30mm in depth, and 17.5mm in height, with a width of 1.181inch. The he
The DSC1121DE1-112.0000T is a 112 MHz MEMS oscillator from Microchip, packaged in a Very Thin Dual Flat No Lead (VDFN) package with 6 pins. It operates over a supply voltage range of 2.25 to 3.6 volts and is suitable for use in temperatures between -20 and
The PSD4131F3V-15UT is an 80-pin SPLD from Stmicroelectronics, packaged in a TQFP lead-frame SMT package. It operates within a temperature range of 0 to 70`C and is designed for surface mount applications. The device is powered by a typical supply voltage
The MTSW-140-10-T-D-010 is an unshrouded header from Samtec, featuring 80 contacts with a 2.54mm terminal pitch. It has a straight body orientation and is designed for through-hole mounting. The header operates within a temperature range of -55`C to 105`
Samtec
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