The maxiGRIP BGA heat sink is a passive thermal management component with a square shape and fins. It is made of anodized aluminium and has a thermal resistance of 8.4`C/W at 100 LFM forced air flow. The heat sink is packaged in bulk and has a package qua

Advanced Thermal Solutions, Inc.

The DSC1121CI1-100.3330T is a 100.333 MHz MEMS oscillator from Microchip, packaged in a 6-pin DFN (Very Thin Dual Flat No Lead) package. It operates over a supply voltage range of 2.25 to 3.6V and is specified for use over a temperature range of -40 to 85

ATMEL Corporation

The Samtec HW-02-12-G-D-825-SM is a 4-contact HDR board stacker with a terminal pitch of 2.54mm, suitable for surface mount applications. It has a minimum operating temperature of -55 degrees Celsius and a maximum operating temperature of 125 degrees Celsi

Samtec

This 16-contact 2-row through-hole shrouded header features gold-plated contacts and is compliant with RoHS regulations. It is available in bulk packaging with a pitch of 5.08mm and can be solder-terminated. The header is designed for use in applications w

Samtec

TRIAC 600V 8.5A 3-Pin TO-92 T/R

WeEn

This SMA RF connector features a stainless steel body with gold plating, a brass contact with gold plating, and a Teflon dielectric material. It is compliant with ELV regulations and has a maximum frequency of 18GHz. The connector is designed for free hang

Tyco Electronics