The maxiFLOW BGA heat sink from Advanced Thermal Solutions is a passive thermal management device with a package type of adhesive. It measures 29mm in length and width, and 17.5mm in height. The heat sink has a thermal resistance of 3.5`C/W at a forced ai
SHUNT, BASE MOUNTED, 500A, 50mV; Current Rating:500A; Accuracy %:0.25%; Operating Temperature Min:-; Operating Temperature Max:-; Product Range:-; Accuracy: 0.25%; Sensing Element:Copper Alloy; Voltage Rating:50mV ;RoHS Compliant: NA
This circular connector features a straight body orientation and 27 terminals. It is designed for jam nut mounting and has a maximum operating temperature of 125`C. The connector is rated for 600VAC and has a termination method of solder. It is suitable f
The DW-24-15-F-S-360 is a 24-contact HDR board stacker from Samtec, designed for through-hole mounting. It features a straight body orientation and a terminal pitch of 2.54mm. The board stacker has a maximum current rating of 3A per contact and operates wi