The maxiFLOW BGA heat sink from Advanced Thermal Solutions is a passive thermal management component with a package type of adhesive. It measures 19mm in length, 19mm in depth, and 7.5mm in height, with a width of 0.748inch. The heat sink is made of alumin

Advanced Thermal Solutions, Inc.

The DSC1123AI1-016.3680 is a 16.368 MHz MEMS oscillator from Microchip, packaged in a 6-pin DFN with exposed pad. It operates over a temperature range of -40 to 85`C and has a frequency stability of a50. The oscillator requires a supply voltage between 2

ATMEL Corporation

DC input optocoupler featuring a single-channel transistor output. This surface mount device, housed in a 4-pin PDIP SMD package with gull-wing leads, offers 5000 Vrms isolation. Key specifications include a maximum collector-emitter voltage of 80V, a ma

TOSHIBA

Conn Unshrouded Header HDR 64 POS 2.54mm Solder ST Thru-Hole

Samtec

Conn Board Stacker HDR 10 POS 2.54mm Solder ST Thru-Hole

Samtec

This 25-position terminal block from TE Connectivity features a 8.26mm pitch and is designed for through hole mounting. It is compliant with ELV regulations and is made from copper alloy terminals with tin plating. The block is available individually and i

Tyco Electronics